|
☦ 河南农业大学论坛 > 最新招聘 > 浏览当前帖子 |
【返回本版】 【发表帖子】 【回复帖子】 | 共 806 浏览 0 回帖 |
楼主 作者:大龙的窝窝 发表时间:2018/9/10 12:12:10 编 辑 | |
Title: Principal/Lead Design Engineer (数字后端设计) Job location: Shanghai/Beijing 更多职位信息敬请关注Cadence公众微信平台:Cadence微招聘 If you have interest, PLS send your update CV to job_china@cadence.com Title: Principal/Lead Physical Design Engineer Position Description:  Perform physical design implementation, including floor planning, power grid design, place and route, clock tree synthesis, timing closure, power/ signal integrity signoff, physical verification (DRC/LVS/Antenna), EM/IR signoff, DFM Closure.  The candidate will have the opportunity to work on many varieties of challenging designs, i.e. low power and high speed design. The responsibility includes participating in or leading next generation PHY IP physical design, methodology and flow development. Position Requirements:  BS degree with 5~15+ years of applicable experience, MS degree with 4~10+ years of applicable experience in electrical engineering, microelectronics.  Experienced with ASIC design flow, hierarchical physical design strategies, and methodologies and understand deep sub-micron technology issues.  Solid knowledge on LP Design, static timing analysis, EM/IR-Drop/ crosstalk analysis, physical verification, DFM.  Successful track records of taping out complex, 16nm/10nm/7nm chips. Automation and programming-minded, solid coding experience in Makefile/Tcl/ Tk/Perl.  Self-motivated, able to work independently or as a team player, excellent verbal and written communication skills in English. |
1 |
©http://www.henau.red Processed in 0.13 河南农业大学论坛 论坛帮助 会员认证 删帖申请 联系我们 |